Close the Semiconductor Manufacturing Process

URN: SEMSEC303
Business Sectors (Suites): Semiconductor Manufacturing
Developed by: Enginuity
Approved on: 30 Mar 2022

Overview

This standard identifies the competences you need to close down the Semiconductor Manufacturing Process (SMP) in accordance with approved procedures. You will be required to use appropriate work instructions and information to ensure that the SMP is ready for closure in accordance with the specification and production requirements whilst ensuring that waste is both minimised and handled in accordance with organisational procedures.

The SMPs relevant to this standard are:

  • Oxidation
  • Photolithography
  • Epitaxy
  • Etching
  • Deposition
  • Doping
  • Surface Mount Technology
  • Packaging

Your responsibilities will require you to comply with organisational policy and procedures for the work activities associated with closing down the Semiconductor Manufacturing Process (SMP), and to report any problems with the work activities, equipment (including plant) or materials that you cannot personally resolve, or are outside your permitted authority, to the relevant people.  You will be expected to work with a minimum of supervision, taking personal responsibility for your own actions and for the quality and accuracy of the work that you produce.

You will understand the techniques used, and their application, in adequate depth to provide a sound basis for carrying out the activities to the required specification. 

You will understand the safety precautions required when carrying out the activities and when using the associated tools and equipment.  You will be required to demonstrate safe working practices throughout and will understand the responsibility you owe to yourself and relevant others in the workplace.


Performance criteria

You must be able to:

  1. access and accurately interpret all work instructions and information relevant to the shutdown of the semiconductor manufacturing processes
  2. work safely at all times and in accordance with all relevant legislation, guidelines, policies, procedures and protocols
  3. deal promptly and effectively with any problems within your control and report those which cannot be solved
  4. identify and minimise hazards and risk in the workplace
  5. access and gather the appropriate equipment, accessories and components to carry out the work activities
  6. wear PPE in accordance with organisational procedures
  7. check that you have the required shut down operation instructions and that they are clear and complete
  8. check that the equipment is in an appropriate condition for shut down to commence
  9. confirm that services are isolated
  10. communicate with all relevant personnel that shut down is imminent
  11. identify and close down those services not required in accordance with organisational procedures
  12. close down the process in accordance with organisational procedures
  13. inform all relevant personnel when shut down is completed
  14. minimise any loss or damage through the operation
  15. control residual and/or waste materials
  16. place product, residual and/or waste materials in suitably labelled containers ready for removal
  17. clean equipment if necessary ready for next operation
  18. reconcile residual materials in accordance with organisational procedures
  19. record all results accurately
  20. report all deviations from specified limits to the appropriate person
  21. communicate, if required, with relevant others
  22. complete and store all relevant documentation in accordance with organisational procedures
  23. dispose of waste in accordance with organisational procedures
  24. leave the work area in a safe condition on completion of the work activities in accordance with organisational procedures

Knowledge and Understanding

You need to know and understand:

  1. the current legislation, guidelines, policies, procedures and protocols which are relevant to your work practice and to which you must adhere
  2. the scope and limitations of your own competence, responsibilities and accountability as it applies to your job role
  3. how to access and interpret all relevant work instructions and information
  4. specific procedures for reporting issues which are beyond your competence, responsibilities and accountability
  5. the duty to report any acts or omissions that could be unsafe/detrimental to you or relevant others
  6. the hazards and risks which may arise during the execution of your work role and how you can minimise these
  7. how to select, put on and remove PPE
  8. the correct use of equipment to protect the health and safety of you and relevant others
  9. how to obtain the authority to enter the relevant work areas and any specific permit-to-work procedures that are used
  10. the meaning of terms used in shut down operation instructions
  11. how to check that the equipment is ready for shut down to commence
  12. methods of shut down for the operation
  13. how to identify and close down those services not required
  14. the importance of keeping relevant personnel informed
  15. why it is important to minimise any loss/damage during shut down
  16. what containers to place product, residual and waste materials in
  17. when it is important to reconcile materials
  18. methods of material reconciliation
  19. what problems may occur in the operation and how to deal with them
  20. when it may be important to observe issues around security and confidentiality
  21. organisational management structures, roles, and responsibilities
  22. the procedures and methods relating to the coordination of individuals and teams within and across services
  23. how to dispose of waste in accordance with organisational procedures
  24. how to complete and safely store all relevant documentation in accordance with organisational procedures

Scope/range


Scope Performance

Semiconductor Manufacturing Processes

  • Oxidation

    • Removing impurities (diffusion/CMP)
    • Dry Oxidation
    • Wet Oxidation
  • Photolithography

    • Coat
    • Expose
    • Develop
    • Inspect
  • Epitaxy

    • Molecular beam method
  • Etching

    • Wet etching (isotropic/anisotropic)
    • Dry etching (chemical sputtering; reactive Ion (RIE)
  • Deposition

    • Wet deposition
    • Dry deposition
  • Doping

    • Ion implantation
  • Surface Mount Technology

  • Packaging

    • Interconnecting
    • Passivation
    • Wafer sawing
    • Wafer attachment
    • Bonding
    • Encapsulation/Moulding

* *

Work instructions and information

  • Drawings
  • Specifications
  • Method statements
  • Work schedules/programmes
  • Manufacturer instructions
  • Environmental requirements
  • Sustainability requirements

* *

* *

Equipment, accessories and components

  • Hand tools
  • Power tools
  • Access equipment
  • Safety equipment (including PPE)
  • In-situ equipment
  • Materials
  • Consumables
  • Plant

Work areas

  • Clean room
  • Non-clean room

* *

Organisational procedures

  • accident reporting
  • communication
  • customer services
  • emergencies
  • implementing and monitoring health and safety requirements and issues
  • implementing and monitoring issues relating to the environment and sustainability
  • information management
  • project management
  • risk assessment

* *

Relevant others

  • client representatives
  • customers/clients
  • service providers
  • site/contract/production manager
  • supervisors
  • work colleagues

Scope Knowledge


Values


Behaviours


Skills


Glossary


Links To Other NOS


External Links


Version Number

1

Indicative Review Date

31 Mar 2025

Validity

Current

Status

Original

Originating Organisation

Enginuity

Original URN

SEMSEC303

Relevant Occupations

Engineering, Engineering and Manufacturing Technologies, Engineering Technicians

SOC Code

3113

Keywords

Close; Semiconductor; Manufacturing; Process