Close the Semiconductor Manufacturing Process

This standard identifies the competences you need to close down the Semiconductor Manufacturing Process (SMP) in accordance with approved procedures. You will be required to use appropriate work instructions and information to ensure that the SMP is ready for closure in accordance with the specification and production requirements whilst ensuring that waste is both minimised and handled in accordance with organisational procedures.
 
The SMPs relevant to this standard are:
·       Oxidation
·       Photolithography
·       Epitaxy
·       Etching
·       Deposition
·       Doping
·       Surface Mount Technology
·       Packaging
 
Your responsibilities will require you to comply with organisational policy and procedures for the work activities associated with closing down the Semiconductor Manufacturing Process (SMP), and to report any problems with the work activities, equipment (including plant) or materials that you cannot personally resolve, or are outside your permitted authority, to the relevant people.  You will be expected to work with a minimum of supervision, taking personal responsibility for your own actions and for the quality and accuracy of the work that you produce.
 
You will understand the techniques used, and their application, in adequate depth to provide a sound basis for carrying out the activities to the required specification. 
 
You will understand the safety precautions required when carrying out the activities and when using the associated tools and equipment.  You will be required to demonstrate safe working practices throughout and will understand the responsibility you owe to yourself and relevant others in the workplace.

1.     access and accurately interpret all work instructions and information relevant to the shutdown of the semiconductor manufacturing processes
2.     work safely at all times and in accordance with all relevant legislation, guidelines, policies, procedures and protocols
3.     deal promptly and effectively with any problems within your control and report those which cannot be solved
4.     identify and minimise hazards and risk in the workplace
5.     access and gather the appropriate equipment, accessories and components to carry out the work activities
6.     wear PPE in accordance with organisational procedures
7.     check that the equipment is in an appropriate condition for shut down to commence
8.     confirm that services are isolated
9.     communicate with all relevant personnel that shut down is imminent
10.  identify and close down those services not required in accordance with organisational procedures
11.  close down the process in accordance with organisational procedures
12.  inform all relevant personnel when shut down is completed
13.  minimise any loss or damage through the operation
14.  control residual and/or waste materials
15.  place product, residual and/or waste materials in suitably labelled containers ready for removal
16.  clean equipment if necessary ready for next operation
17.  reconcile residual materials in accordance with organisational procedures
18.  record all results accurately
19.  report all deviations from specified limits to the appropriate person
20.  communicate, if required, with relevant others
21.  complete and store all relevant documentation in accordance with organisational procedures
22.  dispose of waste in accordance with organisational procedures
23.  leave the work area in a safe condition on completion of the work activities in accordance with organisational procedures

1.     the current legislation, guidelines, policies, procedures and protocols which are relevant to your work practice and to which you must adhere
2.     the scope and limitations of your own competence, responsibilities and accountability as it applies to your job role
3.     how to access and interpret all relevant work instructions and information
4.     specific procedures for reporting issues which are beyond your competence, responsibilities and accountability
5.     the duty to report any acts or omissions that could be unsafe/detrimental to you or relevant others
6.     the hazards and risks which may arise during the execution of your work role and how you can minimise these
7.     how to select, put on and remove PPE
8.     the correct use of equipment to protect the health and safety of you and relevant others
9.     how to obtain the authority to enter the relevant work areas and any specific permit-to-work procedures that are used
10.  the origin and principles of the Semiconductor manufacturing process and how they work
11.  the meaning of terms used in shut down operation instructions
12.  how to check that the equipment is ready for shut down to commence
13.  methods of shut down for the operation
14.  how to identify and close down those services not required
15.  the importance of keeping relevant personnel informed
16.  why it is important to minimise any loss/damage during shut down
17.  what containers to place product, residual and waste materials in
18.  when it is important to reconcile materials
19.  methods of material reconciliation
20.  what problems may occur in the operation and how to deal with them
21.  when it may be important to observe issues around security and confidentiality
22.  the procedures and methods relating to the coordination of individuals and teams within and across services
23.  how to dispose of waste in accordance with organisational procedures
24.  how to complete and safely store all relevant documentation in accordance with organisational procedures

Semiconductor Manufacturing Processes
·       Oxidation
o   Removing impurities (diffusion/CMP)
o   Dry Oxidation
o   Wet Oxidation
·       Photolithography
o   Coat
o   Expose
o   Develop
o   Inspect
·       Epitaxy
o   Molecular beam method
·       Etching
o   Wet etching (isotropic/anisotropic)
o   Dry etching (chemical sputtering; reactive Ion (RIE)
·       Deposition
o   Wet deposition
o   Dry deposition
·       Doping
o   Ion implantation
·       Surface Mount Technology
·       Packaging
o   Interconnecting
o   Passivation
o   Wafer sawing
o   Wafer attachment
o   Bonding
o   Encapsulation/Moulding
 
Work instructions and information
·       Drawings
·       Specifications
·       Method statements
·       Work schedules/programmes
·       Manufacturer instructions
·       Environmental requirements
·       Sustainability requirements

 
Equipment, accessories and components
·       Hand tools
·       Power tools
·       Access equipment
·       Safety equipment (including PPE)
·       In-situ equipment
·       Materials
·       Consumables
·       Plant
 
Work areas
·       Clean room
·       Non-clean room
 
Organisational procedures
·       accident reporting
·       communication
·       customer services
·       emergencies
·       implementing and monitoring health and safety requirements and issues
·       implementing and monitoring issues relating to the environment and sustainability
·       information management
·       project management
·       risk assessment
 
Relevant others
·       client representatives
·       customers/clients
·       service providers
·       site/contract/production manager
·       supervisors
·       work colleagues