Selecting and preparing materials and components for manufacturing

This standard identifies the competences you need to select and prepare materials and components for wafer processing, die assembly/test, printed circuit board manufacture, printed circuit assembly, electronic component manufacture, flexible film circuitry, thin film circuitry, or thick film circuitry work, in accordance with approved procedures. You will be required to access the appropriate specifications, to check that they are of the latest issue and to extract all necessary information, in order to identify which materials (consumables and components) are needed and to obtain them in the quantities required. You will be expected to check the condition of components and materials against manufacturing operation requirements. You will also review the need for and undertake any required specific treatments or preparatory actions.

Your responsibilities will require you to comply with organisational policy and procedures for the selection and preparation activities undertaken and to report any problems with these activities that you cannot personally resolve, or are outside your permitted authority, to the relevant person. You will be expected to undertake these activities with a minimum of supervision, taking responsibility for your own actions and for the quality and accuracy of the work that you carry out.

Your underpinning knowledge will provide a good understanding of your work and will provide an informed approach to applying material selection and preparation procedures. You will understand the work requirement and its application and will know about the overall manufacturing operations, in adequate depth to provide a sound basis for carrying out the activities to the required specification.

You will be expected to know about specific safety precautions, regulations and legislation for the activities. In addition, you will be aware of potential hazards and the precautions that can be taken to minimise associated risks. You will be required to demonstrate safe working practices throughout and will understand the responsibility you owe to yourself and others in the workplace.

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P1    work safely at all times, complying with health and safety and other relevant regulations, directives and guidelines 

P2    follow the relevant instructions, assembly drawings and any other specifications

P3    select and obtain the required materials and check they comply with condition, quantity and quality requirements

P4    prepare materials and components using suitable equipment

P5    deal with problems within your control and report those that cannot be solved

P6    complete and store all relevant documentation in accordance with organisational requirements 

P7    leave the work area in a safe condition on completion of the activities, as per organisational requirements

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K1    how to work safely at all times, complying with health and safety and other relevant regulations, directives and guidelines 

K2    the importance of wearing the appropriate personal protective equipment (PPE), and of keeping the work area clean and tidy 

K3    what constitutes a hazardous voltage and how to reduce the risks of a phase to earth shock 

K4    the specific materials that are needed for the manufacturing operations

K5    how to identify the materials that are to be used

K6    how to obtain and use organisational material and components requirement information for selection and preparation activities

K7    how to obtain and use manufacturers’ data sheets for the selection and preparation of materials

K8    the factors that would make the materials unusable in the manufacturing operations

K9    the preparations to be carried out on the materials and components prior to the manufacturing operations

K10    the issues that can occur when selecting and preparing materials and components for the work areas and activities and how to deal with them

K11    the preparations required for the area of work concerned and how to undertake such preparations

K12    the handling requirements for the selected materials and components

K13    how to obtain the authority to enter the relevant work areas and any specific permit-to-work procedures that are used

K14    the extent of your own responsibility and to whom you should report if you have problems that you cannot resolve

K15    how to access, use and maintain information to comply with organisational requirements and legislation

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1. Select and prepare materials and components by carrying out all of the following activities:
   1. use the correct issue of drawings, specifications, job/order instructions and procedures
   2. follow clean work area protocols, where appropriate
   3. use grounded wrist straps and other electrostatic discharge (ESD) precautions, as appropriate
   4. requisition/obtain all materials/parts
   5. adhere to health and safety regulations, systems and procedures to realise a safe system of work
   6. deal with any issues within your capability/authority and report any issues that you cannot solve
2. Select and prepare materials and components for one of the following manufacturing processes:
   1. wafer processing
   2. electronic component manufacture
   3. die assembly/test
   4. flexible film circuits
   5. printed circuit board manufacture
   6. thick film circuits
   7. printed circuit board assembly
   8. thin film circuits
   9. other process (specify)
3. Obtain material/component specifications from organisational information sources, to include all of the following:
   1. documentation (such as work orders, contracts, memos, plans/designs, purchase orders)
   2. standard operating procedures (such as process control sheets/charts, quality standards)
   3. material/component supplier information
   4. schedules
4. Prepare all of the following materials/components for the manufacturing operations:
   1. consumable materials (such as chemicals for cleaning, solutions for gold, silver or nickel plating, fluxes, solder, wire, strapping, wipes, adhesives)
   2. components/materials to be used in the manufacture (such as plastic housings, connector pins, test point receptacles, capacitors, resistors, inductors, semiconductor wafers, edge connectors)
5. Carry out all of the following preparations on the materials/components to be used:
   1. check condition of components and materials (such as types as specified, freedom from obvious signs of damage, within specified use dates)
   2. conduct any preparatory treatments of components (such as cleaning with chemical solutions, plating, heat treatments) in accordance with data sheets
   3. set out materials and components for use (such as surface mount components for printed circuit board assembly in suitable cassettes, wafers/parts in trays/special jigs)

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4

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2029

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Current

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Original

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Enginuity

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SEMEEE3-10

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Engineering, Engineering and Manufacturing Technologies, Engineering Technicians, Maintenance Team Technician, Manufacturing Technologies, Production and Process Engineers

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2124

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Engineering; electrical; electronic; manufacturing; select; prepare; materials; printed circuit; wafer fabrication; die assembly; die test

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