Monitoring and analysing data from semiconductor processes

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This standard identifies the competences you need to monitor and analyse data from semiconductor manufacturing processes, in accordance with approved procedures. You will be required to access the appropriate specifications, to check that they are of the latest issue and to extract all necessary information, in order to monitor and analyse data from a wafer fabrication or die assembly and test process. You will be expected to use approved organisational procedures to collect and analyse the semiconductor process data and to present this in an approved format. You will also be expected to produce reports of your monitoring and analysis of data (which may include functional D°, process yield, process capability (Cpk), cycle time), which was collected using appropriate tools and methods (such as statistical process control (SPC) and failure mode and effect analysis (FMEA)). Your responsibilities will require you to comply with organisational policy and procedures for the monitoring and analysing semiconductor processes and to report any problems with these activities that you cannot personally resolve, or are outside your permitted authority, to the relevant people. You will be expected to work with a minimum of supervision, taking personal responsibility for your own actions and for the quality and accuracy of the work that you carry out. Your underpinning knowledge will provide a good understanding of your work and will provide an informed approach to applying monitoring/analysis procedures to semiconductor manufacturing processes. You will understand the organisational requirements and procedures for monitoring and analysing data and their application and you will know about the specific semiconductor process being monitored, in adequate depth to provide a sound basis for carrying out the activities to the required specification. You will understand the safety precautions required when working in a semiconductor-processing environment and with the equipment that is used. You will be required to demonstrate safe working practices throughout and will understand the responsibility you owe to yourself and others in the workplace.

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1. work safely at all times, complying with health and safety legislation, regulations, directives and other relevant guidelines
2. ensure the test data for the analysis is available
3. resolve any inconsistencies in the data
4. analyse the data using approved methods and procedures
5. check that the data analysis is accurate, thorough and takes account of the test conditions
6. compare the analysis against the product or asset specification and identify any faults or variations from specification
7. deal promptly and effectively with problems within your control and report those that cannot be solved
8. ensure that work records are completed, stored securely and available to others, as per organisational requirements
9. leave the work area in a safe condition on completion of the activities, as per organisational and legal requirements

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1. the specific safety precautions to be taken whilst carrying out the  activities (including any specific legislation, regulations or codes of practice relating to the activities, equipment or materials)
2. the health and safety requirements of the work area  and the activities, and the responsibility these requirements place on you
3. the hazards associated with  the activities and how to minimise them and reduce risks
4. the personal protective equipment and clothing (PPE) to be worn during the activities
5. how to obtain the authority to enter the relevant work areas and any specific permit-to-work procedures that are used
6. how to obtain and use specifications for the product, assets or processes being monitored/analysed
7. the basic operating principles of other semiconductor processes and how they relate to the particular area in the process being monitored and analysed
8. related processes in other areas of a semiconductor facility undertaking wafer processing and die assembly/test processes
9. the tools, methods and techniques used to monitor and analyse semiconductor processes and how to use them for the process being monitored and analysed (such as statistical process control (SPC), failure mode effect analysis (FMEA))
10. how to explain the terms and how to calculate mean, median, mode, standard deviation, range and variance
11. how to explain and calculate process capability (Cp and Cpk)
12. the meaning of a failure mode, failure effect or failure cause
13. the rating scale used in potential failure modes and effects projects (to include the severity rating scale, the occurrence rating scale and the detection rating scale)
14. how to calculate and use risk priority numbers (RPN)
15. how to carry out a design of experiment project and the tools and techniques used
16. where to obtain the data required to carry out the design of experiment
17. how to calculate the sample size to be used in the design of experiment
18. what is meant by Alpha risk and Beta risk
19. the formats and levels of detail required for recording and preparing reports for the relevant categories of data being monitored/analysed
20. the methods for the presentation of data (such as in tables, charts, graphically)
21. how and why experiments are designed and implemented and by whom
22. the problems that can occur with the data monitoring and collection activities and how they can be avoided
23. the extent of your own responsibility and whom you should report to if you have problems that you cannot resolve
24. how to access, use and maintain information to comply with organisational requirements and legislation

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1. Monitor and analyse data, by carrying out all of the following activities:

   1. use the correct issue of drawings, job instructions and specifications
   2. adhere to health and safety regulations, systems and procedures to realise a safe system of work
   3. follow clean room/work area protocols
   4. carry out all activities in line with organisational procedures
   5. store records of the data analysis in accordance with appropriate procedures

2. Monitor and analyse data for one of the following wafer processing or die assembly/test area processes:

   1. photolithography      
   2. final inspection/probe 
   3. mould
   4. etching (wet/dry)                 
   5. wafer saw                   
   6. trim/form
   7. diffusion                            
   8. die fix                              
   9. debled mark/plate
   10. deposition                         
   11. wire bond                          
   12. test
   13. implantation
   14. other process (specify)

3. Use monitoring and analysis methods and procedures which satisfy all of the following:

   1. quality requirements (such as statistical process control (SPC), failure mode effect analysis (FMEA))
   2. the frequency of the monitoring and analysis required
   3. the aspects, characteristics and complexity of data being monitored/analysed (such as functional D°, process yield, process capability (Cpk), cycle time)
   4. applying various designed experiments

4. Prepare reports for monitoring/analysis purposes, which include three of the following:

   1. customer reports
   2. design of experiments
   3. manufacturing data
   4. process control data
   5. quality control data

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2

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31 Mar 2023

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Current

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Original

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Semta

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SEMEEE3-08

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Engineering, Engineering and Manufacturing Technologies, Engineering Technicians, Maintenance Team Technician, Manufacturing Technologies, Production and Process Engineers

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3113

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Engineering; electrical; electronic; monitor; analyse; data; semiconductor; wafer fabrications; die assembly; die test; process; specification

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